A CMOS accelerometer using bondwire inertial sensing

Yu-Te Liao; W. Biederman; B. Otis

A CMOS accelerometer using bondwire inertial sensing

Yu-Te Liao^*, W. Biederman, B. Otis

^*Corresponding author for this work

Department of Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

5 Scopus citations

Abstract

This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .

Original language	English
Title of host publication	2009 Symposium on VLSI Circuits
Pages	64-65
Number of pages	2
State	Published - 18 Nov 2009
Event	2009 Symposium on VLSI Circuits - Kyoto, Japan Duration: 16 Jun 2009 → 18 Jun 2009

Publication series

Name	IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Conference

Conference	2009 Symposium on VLSI Circuits
Country	Japan
City	Kyoto
Period	16/06/09 → 18/06/09

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Link to publication in Scopus

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title = "A CMOS accelerometer using bondwire inertial sensing",

abstract = "This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .",

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N2 - This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .

AB - This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .

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BT - 2009 Symposium on VLSI Circuits

Y2 - 16 June 2009 through 18 June 2009

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