A CMOS accelerometer using bondwire inertial sensing

Yu-Te Liao*, W. Biederman, B. Otis

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

This paper presents an accelerometer that utilizes standard IC bondwires as an inertial sensor, requiring no external components or MEMS processing. The readout circuitry is implemented in a standard 0.13 m CMOS process and detects the change in mutual inductance caused by the relative deflection of adjacent bondwires. The accelerometer has a measured sensitivity of 10 kHz/g with a bandwidth of 700 Hz, a bias stability of 35 mg and consumes 9 mA from a 1.5 V supply .

Original languageEnglish
Title of host publication2009 Symposium on VLSI Circuits
Pages64-65
Number of pages2
StatePublished - 18 Nov 2009
Event2009 Symposium on VLSI Circuits - Kyoto, Japan
Duration: 16 Jun 200918 Jun 2009

Publication series

NameIEEE Symposium on VLSI Circuits, Digest of Technical Papers

Conference

Conference2009 Symposium on VLSI Circuits
CountryJapan
CityKyoto
Period16/06/0918/06/09

Fingerprint Dive into the research topics of 'A CMOS accelerometer using bondwire inertial sensing'. Together they form a unique fingerprint.

Cite this