Abstract
A method is described which uses accurate measurement of gate-to-drain/source overlap capacitances to determine the gate-to-drain/source overlap length for process control as well as device characterization. The method might also be a useful analytical tool in studying lateral dopant diffusion. Using this technique, the variation in overlap length of MOSFET’s in a 4-in wafer is mapped. It is found that a significant spread of the overlap exits and is attributable to the implant shadowing by the polysilicon gate.
Original language | English |
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Pages (from-to) | 269-271 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | EDL-8 |
Issue number | 6 |
DOIs | |
State | Published - 1 Jan 1987 |