A back-to-face silicon layer stacking for three-dimensional integration

C. S. Tan*, Kuan-Neng Chen, A. Fan, R. Reif

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations
Original languageEnglish
Title of host publication2005 IEEE International SOI Conference - Proceedings
Pages87-89
Number of pages3
DOIs
StatePublished - 1 Dec 2005
Event2005 IEEE International SOI Conference - Honolulu, HI, United States
Duration: 3 Oct 20056 Oct 2005

Publication series

NameProceedings - IEEE International SOI Conference
Volume2005
ISSN (Print)1078-621X

Conference

Conference2005 IEEE International SOI Conference
CountryUnited States
CityHonolulu, HI
Period3/10/056/10/05

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