A back-to-face silicon layer stacking for three-dimensional integration

C. S. Tan*, Kuan-Neng Chen, A. Fan, R. Reif

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations
Original languageEnglish
Title of host publication2005 IEEE International SOI Conference - Proceedings
Pages87-89
Number of pages3
DOIs
StatePublished - 1 Dec 2005
Event2005 IEEE International SOI Conference - Honolulu, HI, United States
Duration: 3 Oct 20056 Oct 2005

Publication series

NameProceedings - IEEE International SOI Conference
Volume2005
ISSN (Print)1078-621X

Conference

Conference2005 IEEE International SOI Conference
CountryUnited States
CityHonolulu, HI
Period3/10/056/10/05

Cite this

Tan, C. S., Chen, K-N., Fan, A., & Reif, R. (2005). A back-to-face silicon layer stacking for three-dimensional integration. In 2005 IEEE International SOI Conference - Proceedings (pp. 87-89). [1563545] (Proceedings - IEEE International SOI Conference; Vol. 2005). https://doi.org/10.1109/SOI.2005.1563545