@inproceedings{534233e0ca8447598969f1fd3dbee0e3,
title = "A 242mW, 10mm2 1080p H.264/AVC high profile encoder chip",
abstract = "A 1080p high profile H.264 encoder is designed by the robust reusable silicon IP methodology and fabricated in a 0.13μm CMOS technology with an area of 10 mm2 and 242mW at 145MHz. Compared to the state-of-the-art design targeted at 720p baseline, this design reduces 53.4% power and 46.7% area through parallelism enhanced throughput and cross stage sharing pipeline.",
keywords = "1080p, Encoder, H.264, High Profile",
author = "Lin, {Yu Kun} and Li, {De Wei} and Lin, {Chia Chun} and Kuo, {Tzu Yun} and Wu, {Sian Jin} and Tai, {Wei Cheng} and Chang, {Wei Cheng} and Tian-Sheuan Chang",
year = "2008",
month = sep,
day = "17",
doi = "10.1109/DAC.2008.4555786",
language = "English",
isbn = "9781605581156",
series = "Proceedings - Design Automation Conference",
pages = "78--83",
booktitle = "Proceedings of the 45th Design Automation Conference, DAC",
note = "null ; Conference date: 08-06-2008 Through 13-06-2008",
}