A 242mW 10mm2 1080p H.264/AVC high-profile encoder chip

Yu Kun Lin; De Wei Li; Chia Chun Lin; Tzu Yun Kuo; Sian Jin Wu; Wei Cheng Tai; Wei Cheng Chang; Tian-Sheuan Chang

doi:10.1109/ISSCC.2008.4523183

A 242mW 10mm² 1080p H.264/AVC high-profile encoder chip

Yu Kun Lin^*, De Wei Li, Chia Chun Lin, Tzu Yun Kuo, Sian Jin Wu, Wei Cheng Tai, Wei Cheng Chang, Tian-Sheuan Chang

^*Corresponding author for this work

Department of Electronics Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

62 Scopus citations

Abstract

A 1080p high profile H.264 encoder has a core area of 10mm² in 0.13μm CMOS and dissipates 242mW from 1.2V supply and 145MHz operating frequency. Compared to a state-of-the-art design targeted at 720p baseline, this design reduces power by 53.4% and area by 46.7% through parallelism-enhanced throughput and cross-stage-sharing pipeline.

Original language	English
Title of host publication	2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC
DOIs	https://doi.org/10.1109/ISSCC.2008.4523183
State	Published - 21 Aug 2008
Event	2008 IEEE International Solid State Circuits Conference, ISSCC - San Francisco, CA, United States Duration: 3 Feb 2008 → 7 Feb 2008

Publication series

Name	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume	51
ISSN (Print)	0193-6530

Conference

Conference	2008 IEEE International Solid State Circuits Conference, ISSCC
Country	United States
City	San Francisco, CA
Period	3/02/08 → 7/02/08

Access to Document

10.1109/ISSCC.2008.4523183

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Lin, Y. K., Li, D. W., Lin, C. C., Kuo, T. Y., Wu, S. J., Tai, W. C., Chang, W. C., & Chang, T-S. (2008). A 242mW 10mm² 1080p H.264/AVC high-profile encoder chip. In 2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC [4523183] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 51). https://doi.org/10.1109/ISSCC.2008.4523183

Lin, Yu Kun ; Li, De Wei ; Lin, Chia Chun ; Kuo, Tzu Yun ; Wu, Sian Jin ; Tai, Wei Cheng ; Chang, Wei Cheng ; Chang, Tian-Sheuan. / A 242mW 10mm² 1080p H.264/AVC high-profile encoder chip. 2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC. 2008. (Digest of Technical Papers - IEEE International Solid-State Circuits Conference).

@inproceedings{9bef27cfa8554b108cd769e7467f2fb2,

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abstract = "A 1080p high profile H.264 encoder has a core area of 10mm2 in 0.13μm CMOS and dissipates 242mW from 1.2V supply and 145MHz operating frequency. Compared to a state-of-the-art design targeted at 720p baseline, this design reduces power by 53.4% and area by 46.7% through parallelism-enhanced throughput and cross-stage-sharing pipeline.",

author = "Lin, {Yu Kun} and Li, {De Wei} and Lin, {Chia Chun} and Kuo, {Tzu Yun} and Wu, {Sian Jin} and Tai, {Wei Cheng} and Chang, {Wei Cheng} and Tian-Sheuan Chang",

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language = "English",

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series = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

booktitle = "2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC",

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Lin, YK, Li, DW, Lin, CC, Kuo, TY, Wu, SJ, Tai, WC, Chang, WC & Chang, T-S 2008, A 242mW 10mm² 1080p H.264/AVC high-profile encoder chip. in 2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC., 4523183, Digest of Technical Papers - IEEE International Solid-State Circuits Conference, vol. 51, 2008 IEEE International Solid State Circuits Conference, ISSCC, San Francisco, CA, United States, 3/02/08. https://doi.org/10.1109/ISSCC.2008.4523183

A 242mW 10mm² 1080p H.264/AVC high-profile encoder chip. / Lin, Yu Kun; Li, De Wei; Lin, Chia Chun; Kuo, Tzu Yun; Wu, Sian Jin; Tai, Wei Cheng; Chang, Wei Cheng; Chang, Tian-Sheuan.

2008 IEEE International Solid State Circuits Conference - Digest of Technical Papers, ISSCC. 2008. 4523183 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 51).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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