A 2.3-mW 11-cm Range Bootstrapped and Correlated-Double-Sampling Three-Dimensional Touch Sensing Circuit for Mobile Devices

Li Du, Yan Zhang, Chun Chen Liu, Adrian Tang, Frank Hsiao, Mau-Chung Chang

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

This brief discusses an oscillator-based capacitive 3-D touch-sensing circuit for mobile devices. The proposed 3-D touch sensor uses correlated double sampling to achieve a high sensing resolution in the Z-direction and employs bootstrapping circuitry to reduce the mobile screen's interchannel-coupling effects. Additionally, to reduce chip area and assembly, the sensing oscillator is implemented with inverter-based active resonators instead of using either on-or off-chip inductors. The prototyped 3-D touch sensor is fabricated using 65-nm CMOS process technology and consumes an area of 2 mm2, with a 2.3-mW power consumption from a 1-V power supply. Measured together with a 3.4′′ HTC standard mobile screen, the sensor achieves an 11-cm Z-direction sensing range with a 1-cm resolution, demonstrating the potential implementation of 3-D finger position sensing in a mobile device.

Original languageEnglish
Article number7452586
Pages (from-to)96-100
Number of pages5
JournalIEEE Transactions on Circuits and Systems II: Express Briefs
Volume64
Issue number1
DOIs
StatePublished - 1 Jan 2017

Keywords

  • 3-D
  • Bootstrapping
  • correlated double sampling (CDS)
  • interchannel coupling
  • mobile device
  • touch screen

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