A 20MS/s buck/boost supply modulator for envelope tracking applications with direct digital interface

Shang Hsien Yang, Chin Long Wey, Ke-Horng Chen, Ying Hsi Lin, Jing Jia Chen, Tsung Yen Tsai, Chao Cheng Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

A buck/boost supply modulator (BBSM) is proposed for 4G LTE RF power amplifier (RF-PA) envelope tracking applications. The H-bridges used in non-inverting buck/boost converters are metamorphosed into the current sources and switches of a 4-bit current-steering DAC-like supply modulator. Fast tracking speed is achieved through its inherent open-loop topology, while the direct digital interface provides easy control and integration with digital LTE baseband SoCs. The proposed BBSM is capable of delivering peak power of 2.8W at 20MS/s, with a peak efficiency of 75 %.

Original languageEnglish
Title of host publicationProceedings - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages73-76
Number of pages4
ISBN (Electronic)9781479940905
DOIs
StatePublished - 13 Jan 2015
Event2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan
Duration: 10 Nov 201412 Nov 2014

Publication series

NameProceedings - 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC 2014

Conference

Conference2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
CountryTaiwan
CityKaohsiung
Period10/11/1412/11/14

Keywords

  • Supply modulator
  • envelope tracking
  • non-inverting buck/boost converter

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