A 176-channel 0.5cm3 0.7g wireless implant for motor function recovery after spinal cord injury

Yi Kai Lo, Chih Wei Chang, Yen-Cheng Kuan, Stanislav Culaclii, Brian Kim, Kuanfu Chen, Parag Gad, V. Reggie Edgerton, Wentai Liu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

21 Scopus citations

Abstract

Epidural spinal stimulation has shown effectiveness in recovering the motor function of spinal cord transected rats by modulating neural networks in lumbosacral spinal segments [1, 2]. The state-of-the-art neuromodulation implant [3] reports a 4-channel stimulator with wireless data and power links for small animal experiments, yet weighs 6g and has a volume of 3cm3. It is preferable that the implant package has a comparable size to its bioelectronics and a high-density stimulator to support stimulation with high spatial resolution. Furthermore, the epidural electrode should be soft and flexible because a mechanical mismatch exists at the tissue-electrode interface [1]. Unlike other implant/SoCs that stimulate with pre-loaded patterns [4-5], the implant for motor function recovery should be capable of adaptively adjusting its stimulation patterns at run time in response to the subject's varying physiological states [2]. Measuring the electrode-tissue impedance is also critical to ensure safe stimulation. Deriving the equivalent circuit model of the electrode-tissue interface determines the safe stimulation boundary (i.e. pulse width and intensity) to ensure the electrode overpotential is within the water window [6]. However, an SoC implementation of this function has not been reported.

Original languageEnglish
Title of host publication2016 IEEE International Solid-State Circuits Conference, ISSCC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages382-383
Number of pages2
ISBN (Electronic)9781467394666
DOIs
StatePublished - 23 Feb 2016
Event63rd IEEE International Solid-State Circuits Conference, ISSCC 2016 - San Francisco, United States
Duration: 31 Jan 20164 Feb 2016

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume59
ISSN (Print)0193-6530

Conference

Conference63rd IEEE International Solid-State Circuits Conference, ISSCC 2016
CountryUnited States
CitySan Francisco
Period31/01/164/02/16

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