60 GHz broadband MS-to-CPW hot-via flip chip interconnects

Wei Cheng Wu*, Li Han Hsu, Edward Yi Chang, Camilla Kärnfelt, Herbert Zirath, J. Piotr Starski, Yun Chi Wu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

In this letter, the microstrip-to-coplanar waveguide (MS-to-CPW) hot-via flip chip interconnect has been experimentally demonstrated to have broadband performance from dc to 67 GHz. The interconnect structures with the hot-via transitions were first designed and optimized by using the electromagnetic simulation tool. Three types of designs were investigated in this letter. The interconnect structures were then fabricated and radio frequency (RF) tested up to 67 GHz. The optimized interconnect structure with the compensation design demonstrated excellent RF characteristics with the insertion loss less than 0.5 dB and the return loss below 18 dB over a very broad bandwidth from dc to 67 GHz. This is to our knowledge the best result reported for this frequency range.

Original languageEnglish
Pages (from-to)784-786
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume17
Issue number11
DOIs
StatePublished - 1 Nov 2007

Keywords

  • Coplanar waveguide (CPW)
  • Finite ground coplanar (FGC) waveguide
  • Flip chip
  • Hot-via
  • Interconnect
  • Microstrip (MS)

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