60 GHz broadband 0/1-level RF-via interconnect for RF-MEMS packaging

W. C. Wu*, L. H. Hsu, Edward Yi Chang, J. P. Starski, H. Zirath

*Corresponding author for this work

Research output: Contribution to journalArticle

4 Scopus citations

Abstract

The RF-via interconnect structure from the 0- to the 1-level package for coplanar RF-MEMS devices packaging is evaluated. The 0/1-level interconnect structure was designed and optimised using the electromagnetic simulation tool. The structure was then successfully fabricated and characterised up to 67 GHz. The measured and simulated results show good agreement, demonstrating DC-to-60 GHz broadband interconnect performance through the two levels package with return loss below 15 dB and insertion loss within 0.6 dB.

Original languageEnglish
Pages (from-to)1203-1205
Number of pages3
JournalElectronics Letters
Volume43
Issue number22
DOIs
StatePublished - 30 Oct 2007

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