3D silicon pixel sensors: Recent test beam results

P. Hansson; J. Balbuena; C. Barrera; E. Bolle; M. Borri; M. Boscardin; M. Chmeissan; G. F. Dalla Betta; G. Darbo; C. Da Via; E. Devetak; B. Dewilde; D. Su; O. Dorholt; S. Fazio; C. Fleta; C. Gemme; M. Giordani; H. Gjersdal; P. Grenier; S. Grinstein; J. Hasi; K. Helle; F. Huegging; P. Jackson; C. Kenney; M. Kocian; I. Korolkov; A. La Rosa; A. Mastroberardino; A. Micelli; C. Nellist; P. Nordahl; F. Rivero; O. Rohne; H. Sandaker; D. Silverstein; K. Sjoebaek; T. Slaviec; J. Stupak; I. Troyano; Jieh-Wen Tsung; D. Tsybychev; N. Wermes; C. Young

doi:10.1016/j.nima.2010.06.321

3D silicon pixel sensors: Recent test beam results

P. Hansson^*, J. Balbuena, C. Barrera, E. Bolle, M. Borri, M. Boscardin, M. Chmeissan, G. F. Dalla Betta, G. Darbo, C. Da Via, E. Devetak, B. Dewilde, D. Su, O. Dorholt, S. Fazio, C. Fleta, C. Gemme, M. Giordani, H. Gjersdal, P. GrenierS. Grinstein, J. Hasi, K. Helle, F. Huegging, P. Jackson, C. Kenney, M. Kocian, I. Korolkov, A. La Rosa, A. Mastroberardino, A. Micelli, C. Nellist, P. Nordahl, F. Rivero, O. Rohne, H. Sandaker, D. Silverstein, K. Sjoebaek, T. Slaviec, J. Stupak, I. Troyano, Jieh-Wen Tsung, D. Tsybychev, N. Wermes, C. Young

^*Corresponding author for this work

Department of Electrophysics

Research output: Contribution to journal › Article

7 Scopus citations

Abstract

The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50×400μm2. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.

Original language	English
Pages (from-to)	216-220
Number of pages	5
Journal	Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume	628
Issue number	1
DOIs	https://doi.org/10.1016/j.nima.2010.06.321
State	Published - 2 Feb 2011

Keywords

3D sensors
ATLAS upgrade
Radiation detectors
SLHC
Silicon sensors

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10.1016/j.nima.2010.06.321

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Hansson, P., Balbuena, J., Barrera, C., Bolle, E., Borri, M., Boscardin, M., Chmeissan, M., Dalla Betta, G. F., Darbo, G., Da Via, C., Devetak, E., Dewilde, B., Su, D., Dorholt, O., Fazio, S., Fleta, C., Gemme, C., Giordani, M., Gjersdal, H., ... Young, C. (2011). 3D silicon pixel sensors: Recent test beam results. Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 628(1), 216-220. https://doi.org/10.1016/j.nima.2010.06.321

Hansson, P. ; Balbuena, J. ; Barrera, C. ; Bolle, E. ; Borri, M. ; Boscardin, M. ; Chmeissan, M. ; Dalla Betta, G. F. ; Darbo, G. ; Da Via, C. ; Devetak, E. ; Dewilde, B. ; Su, D. ; Dorholt, O. ; Fazio, S. ; Fleta, C. ; Gemme, C. ; Giordani, M. ; Gjersdal, H. ; Grenier, P. ; Grinstein, S. ; Hasi, J. ; Helle, K. ; Huegging, F. ; Jackson, P. ; Kenney, C. ; Kocian, M. ; Korolkov, I. ; La Rosa, A. ; Mastroberardino, A. ; Micelli, A. ; Nellist, C. ; Nordahl, P. ; Rivero, F. ; Rohne, O. ; Sandaker, H. ; Silverstein, D. ; Sjoebaek, K. ; Slaviec, T. ; Stupak, J. ; Troyano, I. ; Tsung, Jieh-Wen ; Tsybychev, D. ; Wermes, N. ; Young, C. / 3D silicon pixel sensors : Recent test beam results. In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 2011 ; Vol. 628, No. 1. pp. 216-220.

@article{da03f3a126034a63aefaed6657f70acf,

title = "3D silicon pixel sensors: Recent test beam results",

abstract = "The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50×400μm2. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.",

keywords = "3D sensors, ATLAS upgrade, Radiation detectors, SLHC, Silicon sensors",

author = "P. Hansson and J. Balbuena and C. Barrera and E. Bolle and M. Borri and M. Boscardin and M. Chmeissan and {Dalla Betta}, {G. F.} and G. Darbo and {Da Via}, C. and E. Devetak and B. Dewilde and D. Su and O. Dorholt and S. Fazio and C. Fleta and C. Gemme and M. Giordani and H. Gjersdal and P. Grenier and S. Grinstein and J. Hasi and K. Helle and F. Huegging and P. Jackson and C. Kenney and M. Kocian and I. Korolkov and {La Rosa}, A. and A. Mastroberardino and A. Micelli and C. Nellist and P. Nordahl and F. Rivero and O. Rohne and H. Sandaker and D. Silverstein and K. Sjoebaek and T. Slaviec and J. Stupak and I. Troyano and Jieh-Wen Tsung and D. Tsybychev and N. Wermes and C. Young",

year = "2011",

month = feb,

day = "2",

doi = "10.1016/j.nima.2010.06.321",

language = "English",

volume = "628",

pages = "216--220",

journal = "Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment",

issn = "0168-9002",

publisher = "Elsevier",

number = "1",

}

Hansson, P, Balbuena, J, Barrera, C, Bolle, E, Borri, M, Boscardin, M, Chmeissan, M, Dalla Betta, GF, Darbo, G, Da Via, C, Devetak, E, Dewilde, B, Su, D, Dorholt, O, Fazio, S, Fleta, C, Gemme, C, Giordani, M, Gjersdal, H, Grenier, P, Grinstein, S, Hasi, J, Helle, K, Huegging, F, Jackson, P, Kenney, C, Kocian, M, Korolkov, I, La Rosa, A, Mastroberardino, A, Micelli, A, Nellist, C, Nordahl, P, Rivero, F, Rohne, O, Sandaker, H, Silverstein, D, Sjoebaek, K, Slaviec, T, Stupak, J, Troyano, I, Tsung, J-W, Tsybychev, D, Wermes, N & Young, C 2011, '3D silicon pixel sensors: Recent test beam results', Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 628, no. 1, pp. 216-220. https://doi.org/10.1016/j.nima.2010.06.321

3D silicon pixel sensors : Recent test beam results. / Hansson, P.; Balbuena, J.; Barrera, C.; Bolle, E.; Borri, M.; Boscardin, M.; Chmeissan, M.; Dalla Betta, G. F.; Darbo, G.; Da Via, C.; Devetak, E.; Dewilde, B.; Su, D.; Dorholt, O.; Fazio, S.; Fleta, C.; Gemme, C.; Giordani, M.; Gjersdal, H.; Grenier, P.; Grinstein, S.; Hasi, J.; Helle, K.; Huegging, F.; Jackson, P.; Kenney, C.; Kocian, M.; Korolkov, I.; La Rosa, A.; Mastroberardino, A.; Micelli, A.; Nellist, C.; Nordahl, P.; Rivero, F.; Rohne, O.; Sandaker, H.; Silverstein, D.; Sjoebaek, K.; Slaviec, T.; Stupak, J.; Troyano, I.; Tsung, Jieh-Wen; Tsybychev, D.; Wermes, N.; Young, C.

In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 628, No. 1, 02.02.2011, p. 216-220.

Research output: Contribution to journal › Article

TY - JOUR

T1 - 3D silicon pixel sensors

T2 - Recent test beam results

AU - Hansson, P.

AU - Balbuena, J.

AU - Barrera, C.

AU - Bolle, E.

AU - Borri, M.

AU - Boscardin, M.

AU - Chmeissan, M.

AU - Dalla Betta, G. F.

AU - Darbo, G.

AU - Da Via, C.

AU - Devetak, E.

AU - Dewilde, B.

AU - Su, D.

AU - Dorholt, O.

AU - Fazio, S.

AU - Fleta, C.

AU - Gemme, C.

AU - Giordani, M.

AU - Gjersdal, H.

AU - Grenier, P.

AU - Grinstein, S.

AU - Hasi, J.

AU - Helle, K.

AU - Huegging, F.

AU - Jackson, P.

AU - Kenney, C.

AU - Kocian, M.

AU - Korolkov, I.

AU - La Rosa, A.

AU - Mastroberardino, A.

AU - Micelli, A.

AU - Nellist, C.

AU - Nordahl, P.

AU - Rivero, F.

AU - Rohne, O.

AU - Sandaker, H.

AU - Silverstein, D.

AU - Sjoebaek, K.

AU - Slaviec, T.

AU - Stupak, J.

AU - Troyano, I.

AU - Tsung, Jieh-Wen

AU - Tsybychev, D.

AU - Wermes, N.

AU - Young, C.

PY - 2011/2/2

Y1 - 2011/2/2

N2 - The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50×400μm2. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.

AB - The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension 50×400μm2. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6 T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.

KW - 3D sensors

KW - ATLAS upgrade

KW - Radiation detectors

KW - SLHC

KW - Silicon sensors

UR - http://www.scopus.com/inward/record.url?scp=79251597861&partnerID=8YFLogxK

U2 - 10.1016/j.nima.2010.06.321

DO - 10.1016/j.nima.2010.06.321

M3 - Article

AN - SCOPUS:79251597861

VL - 628

SP - 216

EP - 220

JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

SN - 0168-9002

IS - 1

ER -