3D printed RF passive components by liquid metal filling

Chen Yang, Sung Yueh Wu, Casey Glick, Yun Seok Choi, Wen-Syang Hsu, Liwei Lin

Research output: Contribution to journalConference articlepeer-review

15 Scopus citations

Abstract

We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.

Original languageEnglish
Article number7050938
Pages (from-to)261-264
Number of pages4
JournalProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2015-February
Issue numberFebruary
DOIs
StatePublished - 26 Feb 2015
Event2015 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2015 - Estoril, Portugal
Duration: 18 Jan 201522 Jan 2015

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