3D-printed microelectronics for integrated circuitry and passive wireless sensors

Sung Yueh Wu, Chen Yang, Wen-Syang Hsu, Liwei Lin*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

155 Scopus citations

Abstract

Three-dimensional (3D) additive manufacturing techniques have been utilized to make 3D electrical components, such as resistors, capacitors, and inductors, as well as circuits and passive wireless sensors. Using the fused deposition modeling technology and a multiple-nozzle system with a printing resolution of 30 μm, 3D structures with both supporting and sacrificial structures are constructed. After removing the sacrificial materials, suspensions with silver particles are injected subsequently solidified to form metallic elements/interconnects. The prototype results show good characteristics of fabricated 3D microelectronics components, including an inductor–capacitor-resonant tank circuitry with a resonance frequency at 0.53 GHz. A 3D “smart cap” with an embedded inductor–capacitor tank as the wireless passive sensor was demonstrated to monitor the quality of liquid food (e.g., milk and juice) wirelessly. The result shows a 4.3% resonance frequency shift from milk stored in the room temperature environment for 36 h. This work establishes an innovative approach to construct arbitrary 3D systems with embedded electrical structures as integrated circuitry for various applications, including the demonstrated passive wireless sensors.

Original languageEnglish
Article number15013
JournalMicrosystems and Nanoengineering
Volume1
DOIs
StatePublished - 1 Jan 2015

Keywords

  • 3D inductors and capacitors
  • Additive manufacturing
  • Radio-frequency passive sensors
  • Three-dimensional printing
  • Wireless sensing

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