3-D simulation on current density distribution in flip-chip solder joints with thick Cu UBM under current stressing

S. W. Liang*, T. L. Shao, Chih Chen

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

19 Scopus citations

Abstract

In flip-chip solder joints, Cu has been used as a underbump metallization (UBM) for its excellent wettability with solders. In addition, electromigration has become an crucial reliability concerns for fine-pitch flip chip solder joints. In this paper, 3-D finite element method was employed to simulate the current density distribution for the eutectic SnPb solder joints with 5 μm, 10 μm, and 20 urn thick Cu UBM. It was found that the thicker the UBM is, the lower the maximum current density inside the solder. The maximum current density decreased from 4.37 × 10 4 A/cm 2 to 7.54 × 10 3 A/cm 2 when the thickness of the UBM changed from 5 μm to 20 μm. Thicker Cu UBM can effectively relieve the current crowding effect inside the solder.

Original languageEnglish
Pages (from-to)1416-1420
Number of pages5
JournalProceedings - Electronic Components and Technology Conference
Volume2
DOIs
StatePublished - 19 Sep 2005
Event55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 31 May 20054 Jun 2005

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