2D MOSFET operation of a fully-depleted bulk MoS2 at quasi-flatband back-gate

M. Najmzadeh, J. P. Duarte, S. Khandelwal, Y. Zeng, Chen-Ming Hu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations


In this paper, 2D MOSFET operation of a fully-depleted double-gate bulk MoS2 is studied at a quasi-flatband of the back-gate for the first time. Several key device parameters such as equivalent oxide thickness (EOT), carrier concentration, flatband voltage, dielectric constant and carrier mobility were extracted from I-V and C-V characteristics and at room temperature. In a similar operation to the inversion-mode SOI MOSFETs in [1], the backgate was used to keep a sheet of mobile charges on the flake back-side by its quasi-flatband operation at a fixed voltage (0 V). Afterward, the top-gate was used as the active gate to perform mobile charge accumulation or depletion in the channel. Fig. 1 shows the device architecture together with the high frequency R-C equivalent circuit model for this underlap gate architecture. Fig. 2 represents the top-view microscope picture of the fabricated MoS2 bulk MOSFET with a flake thickness of 38 nm, measured by AFM. The fabrication steps include mechanical exfoliation of MoS2 crystals on a 260 nm thick oxidized Si substrate, e-beam lithography to make S/D pads, 50 nm Ni by thermal evaporation and lift-off, gate patterning, high-k/metal-gate stack deposition (1 nm of SiOx by thermal evaporation, 11 nm of ZrO2 by ALD deposition at 105 °C, 30 nm of Ni by thermal evaporation) and lift-off. The measurements were done at room temperature using an Agilent B1500A Semiconductor Parameter Analyzer. Fig. 3 shows its Id-Vg, reporting a subthreshold slope of 110 mV/dec. and Ion/Ioff of ∼1×105, both at Vds=100 mV.

Original languageEnglish
Title of host publication73rd Annual Device Research Conference, DRC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages2
ISBN (Electronic)9781467381345
StatePublished - 3 Aug 2015
Event73rd Annual Device Research Conference, DRC 2015 - Columbus, United States
Duration: 21 Jun 201524 Jun 2015

Publication series

NameDevice Research Conference - Conference Digest, DRC
ISSN (Print)1548-3770


Conference73rd Annual Device Research Conference, DRC 2015
CountryUnited States


  • Capacitance
  • Capacitance-voltage characteristics
  • Dielectric constant
  • Logic gates
  • Nickel
  • Resistance

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