2.5D heterogeneously integrated microsystem for high-density neural sensing applications

Po-Tsang Huang, Shang Lin Wu, Yu Chieh Huang, Lei Chun Chou, Teng Chieh Huang, Tang Hsuan Wang, Yu Rou Lin, Chuan An Cheng, Wen Wei Shen, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Ho Ming Tong

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with μ-probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of μ-probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 × 24 μ-probe array with embedded TSVs is fabricated on a 5 × 5 mm2 chip and bonded on the back side of the interposer. Thus, each channel contains 6 × 6 μ-probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (μ-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 μW for 16-channel neural sensing.

Original languageEnglish
Article number7001275
Pages (from-to)810-823
Number of pages14
JournalIEEE Transactions on Biomedical Circuits and Systems
Volume8
Issue number6
DOIs
StatePublished - 1 Dec 2014

Keywords

  • 2.5D heterogeneous integration
  • Analog front-end (AFE)
  • Configurable discrete wavelet transform (DWT)
  • Low-power ADC
  • Neural sensing microsystem
  • On-interposer bus
  • Through-silicon-via (TSV)
  • μ-probes

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