2.5D heterogeneously integrated bio-sensing microsystem for multi-channel neural-sensing applications

Po-Tsang Huang, Lei Chun Chou, Teng Chieh Huang, Shang Lin Wu, Tang Shuan Wang, Yu Rou Lin, Chuan An Cheng, Wen Wei Shen, Kuan-Neng Chen, Jin-Chern Chiou, Ching Te Chuang, Wei Hwang, Kuo Hua Chen, Chi Tsung Chiu, Ming Hsiang Cheng, Yueh Lung Lin, Ho Ming Tong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

Heterogeneously integrated and miniaturized neural sensing microsystems for accurately capturing and classifying signals are crucial for brain function investigation and neural prostheses realization [1]. Many neural sensing microsystems have been proposed to provide small form-factor and biocompatible properties, including stacked multichip [2, 3], microsystem with separated neural sensors [4], monolithic packaged microsystem [5] and through-silicon-via (TSV) based double-side integrated microsystem [6]. These heterogeneous biomedical devices are composed of sensors and CMOS circuits for biopotential acquisition, signal processing and transmission. However, the weak signals detected from sensors in [2-5] have to pass through a string of interconnections to the CMOS circuits by wire bonding. In view of this, TSV-based double-side integration [6] uses TSV arrays to transfer the weak signals from μ-probe arrays to CMOS circuits for reducing noises. Nevertheless, the double-side integration requires preserving large area for separate μ-probe arrays and TSV arrays, and the TSV fabrication process may induce damage on CMOS circuits.

Original languageEnglish
Title of host publication2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages320-321
Number of pages2
ISBN (Print)9781479909186
DOIs
StatePublished - 1 Jan 2014
Event2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014 - San Francisco, CA, United States
Duration: 9 Feb 201413 Feb 2014

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume57
ISSN (Print)0193-6530

Conference

Conference2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
CountryUnited States
CitySan Francisco, CA
Period9/02/1413/02/14

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