183GHz 13.5mW/pixel CMOS regenerative receiver for mm-wave imaging applications

Adrian Tang*, Mau-Chung Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

24 Scopus citations

Abstract

Terahertz- and mm-Wave-based imagers have recently gained interest for imaging in security screening and bio-imaging applications [1,2]. For these applications to become practical, the core pixel circuits employed in an imaging array must meet challenging constraints that originate from the system level design and the needs of constructing large array structures on-chip. The most critical of these constraints is that the pixel must consume very low power, as an array will inflate the total power by n2, where n2 is the total number of pixels in a square (n x n) array. Pixel circuit area is the 2nd major constraint, as the single pixel area will be also inflated by n2. This area constraint is critical because the cost-effective pixel array should ideally fit on a wafer to facilitate monolithic fabrication and avoid the need for complicated mechanical assembly of multiple array sections. A third system-level constraint similar to that experienced in CMOS image sensor arrays is the challenge of routing large numbers of analog signals between each pixel in the array and the sampling ADC.

Original languageEnglish
Title of host publication2011 IEEE International Solid-State Circuits Conference - Digest of Technical Papers, ISSCC 2011
Pages296-297
Number of pages2
DOIs
StatePublished - 12 May 2011
Event2011 IEEE International Solid-State Circuits Conference, ISSCC 2011 - San Francisco, CA, United States
Duration: 20 Feb 201124 Feb 2011

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
ISSN (Print)0193-6530

Conference

Conference2011 IEEE International Solid-State Circuits Conference, ISSCC 2011
CountryUnited States
CitySan Francisco, CA
Period20/02/1124/02/11

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