In this paper, high-speed multi-mode waveguide array is proposed. As a core material, a polymer called SU-8 is used. The index of SU-8 at a wavelength of 850 nm is 1.58. It is highly transparent for wavelengths > 800 nm, has shown heat resistance to temperature > 200 degrees Celsius and it is chemically and mechanically stable , so it is most suited for optical interconnect applications. In order to reduce the coupling loss of the system, the dimensions of waveguides are taken to be 50×50μm 2 . The SU-8 is spin-coated on the glass substrate. By varying the spin speed, the height of the layer can be varied from 10 to 60 μm. The layer is pre-baked at 95 degrees Celsius to evaporate the solvent. Then after pre-heating, the film is exposed to UV-light with a mask. Following the UV-exposure, the film is post-baked at a temperature of again 95 degrees Celsius. In this post exposure baking step the cross-linking of the polymer takes place in all exposed areas. The SU-8 film is developed in RER 600 (PGMEA). Next, the defined structures are exposed to UV-light and hard-baked at 150 degrees Celsius . Finally, the embedded waveguides are covered by cladding layer and measured by 850 nm LD. The measurements demonstrate robust 10 Gbps data transmission exceeding 50mm using a new high-speed 50μm multimode planar waveguide circuit (PLC). The this indicates that experiments driving VCSEL-based 850nm LD optical links 231-1 PRBS signal at speeds up to 10 Gbps. The results can be used to broaden the component specification range for 10 Gigabit optical interconnects applications.
|Number of pages||5|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - 19 Sep 2005|
|Event||55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States|
Duration: 31 May 2005 → 4 Jun 2005