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Personal profile

Research Interests

Soft Bioelectronics, Neural implant, MEMS, Biomaterials, Tissue engineering

Education/Academic qualification

PhD, National Chiao Tung University

1 Sep 201114 May 2015

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Projects

Research Output

  • 20 Article
  • 1 Conference contribution

Spontaneously Micropatterned Silk/Gelatin Scaffolds with Topographical, Biological, and Electrical Stimuli for Neuronal Regulation

Lin, C. C., Chang, J. J., Yung, M. C., Huang, W-C. & Chen, S-Y., 10 Feb 2020, In : ACS Biomaterials Science and Engineering. 6, 2, p. 1144-1153 10 p.

Research output: Contribution to journalArticle

  • 1 Scopus citations

    Gene-Embedded Nanostructural Biotic-Abiotic Optoelectrode Arrays Applied for Synchronous Brain Optogenetics and Neural Signal Recording

    Huang, W-C., Chi, H. S., Lee, Y. C., Lo, Y. C., Liu, T. C., Chiang, M. Y., Chen, H. Y., Li, S. J., Chen, Y. Y. & Chen, S-Y., 27 Mar 2019, In : ACS Applied Materials and Interfaces. 11, 12, p. 11270-11282 13 p.

    Research output: Contribution to journalArticle

  • 5 Scopus citations

    Fabrication of co-electrodeposition of plasma proteins/iridium oxide hybrid films

    Huang, C. N., Tang, Z. T., Chan, F. E., Burnouf, T., Huang, W-C. & Chen, P. C., 1 Nov 2018, In : Ceramics International. 44, p. S117-S120

    Research output: Contribution to journalArticle

  • 1 Scopus citations

    Ultracompliant Hydrogel-Based Neural Interfaces Fabricated by Aqueous-Phase Microtransfer Printing

    Huang, W-C., Ong, X. C., Kwon, I. S., Gopinath, C., Fisher, L. E., Wu, H., Fedder, G. K., Gaunt, R. A. & Bettinger, C. J., 18 Jul 2018, In : Advanced Functional Materials. 28, 29, 1801059.

    Research output: Contribution to journalArticle

    Open Access
  • 16 Scopus citations

    Ultra-compliant peripheral nerve cuff electrode with hydrogel adhesion

    Ong, X. C., Huang, W-C., Kwon, I. S., Gopinath, C., Wu, H., Fisher, L. E., Gaunt, R. A., Bettinger, C. J. & Fedder, G. K., 24 Apr 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Institute of Electrical and Electronics Engineers Inc., p. 376-379 4 p. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); vol. 2018-January).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • 2 Scopus citations