Projects per year
Personal profile
Research Interests
Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies
Experience
Education/Academic qualification
PhD, Massachusetts Institute of Technology
External positions
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Network
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Projects
Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
強化與東協及南亞國家合作交流計畫
1/05/20 → 28/02/21
Project: Government Ministry › Ministry of Education(Include School)
Development of 2.5D Heterogeneous Integration Platform Using Self- Assembly Technologies
1/01/20 → 31/12/20
Project: Government Ministry › Ministry of Science and Technology
新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)
1/10/19 → 31/12/20
Project: Government Ministry › Ministry of Education(Include School)
Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/22 → 31/07/23
Project: Government Ministry › Ministry of Science and Technology
Research Output
A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K. N., Wu, S. H., Lee, Y. M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding
Lu, C. H., Yang, Y. L., Chen, C. P., Tsai, B. L. & Chen, K. N., Jan 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 168-175 8 p., 8843892.Research output: Contribution to journal › Article
Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration
Yang, Y. L., Ito, H., Kim, Y. S., Ohba, T. & Chen, K. N., Jun 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 6, p. 956-962 7 p., 8966252.Research output: Contribution to journal › Article
Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Chou, T. C., Yang, K. M., Li, J. C., Yu, T. Y., Yang, Y. T., Hu, H. W., Liu, Y. W., Ko, C. T., Chen, Y. H., Tseng, T. J. & Chen, K-N., Aug 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 8, p. 1296-1303 8 p., 9125981.Research output: Contribution to journal › Article
Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
Tsai, Y-C., Hu, H-W. & Chen, K-N., Aug 2020, In : IEEE Electron Device Letters. 41, 8, p. 1229-1232 4 p., 9112267.Research output: Contribution to journal › Article
Prizes
Excellent Young Electrical Engineer Award, Chinese Institute of Electrical Engineering
Chen, Kuan-Neng (Recipient), 2012
Prize: Honorary award
IEEE EPS Exceptional Technical Achievement Award
Chen, Kuan-Neng (Recipient), 2018
Prize: Honorary award
Activities
- 1 Invited talk
IEEE Interconnect Technology Conference (IITC)
Kuan-Neng Chen (Speaker)
4 Jun 2018
Activity: Talk or presentation › Invited talk