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Personal profile

Research Interests

Three-Dimensional Integrated Circuits, Heterogeneous Integration, Advanced Packaging Technologies

Experience

Education/Academic qualification

PhD, Massachusetts Institute of Technology

External positions

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Projects

Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

Chen, K.

1/08/2031/07/21

Project: Government MinistryMinistry of Science and Technology

強化與東協及南亞國家合作交流計畫

Chen, K.

1/05/2028/02/21

Project: Government MinistryMinistry of Education(Include School)

Development of 2.5D Heterogeneous Integration Platform Using Self- Assembly Technologies

Chen, K.

1/01/2031/12/20

Project: Government MinistryMinistry of Science and Technology

新南向及全球先進國家優秀外國青年學子來臺蹲點計畫(TEEP@AsiaPlus)

Chen, K.

1/10/1931/12/20

Project: Government MinistryMinistry of Education(Include School)

Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

Chen, K.

1/08/2231/07/23

Project: Government MinistryMinistry of Science and Technology

Research Output

A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design

Huang, M. Y., Chen, H-M., Chen, K. N., Wu, S. H., Lee, Y. M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

    Lu, C. H., Yang, Y. L., Chen, C. P., Tsai, B. L. & Chen, K. N., Jan 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 168-175 8 p., 8843892.

    Research output: Contribution to journalArticle

  • Evaluation of Metal/Polymer Adhesion and Highly Reliable Four-Point Bending Test Using Stealth Dicing Method in 3-D Integration

    Yang, Y. L., Ito, H., Kim, Y. S., Ohba, T. & Chen, K. N., Jun 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 6, p. 956-962 7 p., 8966252.

    Research output: Contribution to journalArticle

  • Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration

    Chou, T. C., Yang, K. M., Li, J. C., Yu, T. Y., Yang, Y. T., Hu, H. W., Liu, Y. W., Ko, C. T., Chen, Y. H., Tseng, T. J. & Chen, K-N., Aug 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 8, p. 1296-1303 8 p., 9125981.

    Research output: Contribution to journalArticle

  • Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation

    Tsai, Y-C., Hu, H-W. & Chen, K-N., Aug 2020, In : IEEE Electron Device Letters. 41, 8, p. 1229-1232 4 p., 9112267.

    Research output: Contribution to journalArticle

    Prizes

    Advantech Young Professor Award, Advantech

    Chen, Kuan-Neng (Recipient), 2010

    Prize: Honorary award

    IEEE Fellow

    Chen, Kuan-Neng (Recipient), 2018

    Prize: Honorary award

  • Activities

    • 1 Invited talk

    IEEE Interconnect Technology Conference (IITC)

    Kuan-Neng Chen (Speaker)

    4 Jun 2018

    Activity: Talk or presentationInvited talk