Research Output per year
Research Output per year
Personal profile
Research Interests
Kinetic processes in thin films, metal-Si interfaces, electromigration, Pb-free solder metallurgy, low dielectric constant thin film,phase change driven by high current density and high electric and magnetic fields.
Education/Academic qualification
PhD, Harvard University
External positions
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Research Output
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A high-entropy alloy as very low melting point solder for advanced electronic packaging
Liu, Y., Pu, L., Yang, Y., He, Q., Zhou, Z., Tan, C., Zhao, X., Zhang, Q. & Tu, K. N., Sep 2020, In: Materials Today Advances. 7, 100101.Research output: Contribution to journal › Article › peer-review
Open Access -
Deformation induced columnar grain rotation in nanotwinned metals
Li, Y. J., Hsu, C. W., Ting, Y. H., Tsou, N-T., Lo, Y-C., Wu, W. W., Tu, K-N. & Chen, C., 21 Oct 2020, In: Materials Science and Engineering A. 797, 140045.Research output: Contribution to journal › Article › peer-review
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Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation
Pu, L., Liu, Y., Yang, Y., He, Q., Zhou, Z., Zhao, X., Tan, C. & Tu, K. N., 1 Aug 2020, In: Materials Letters. 272, 127891.Research output: Contribution to journal › Article › peer-review
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Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints
Gusak, A. M., Tu, K-N. & Chen, C., 1 Apr 2020, In: Scripta Materialia. 179, p. 45-48 4 p.Research output: Contribution to journal › Article › peer-review
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Fabrication and characteristics of highly 110-oriented nanotwinned Au films
Chiu, W-L., Liu, C-M., Lin, H., Wu, J. A., Chou, Y-C., Tu, K-N. & Chen, C., 6 Oct 2020, In: Scientific reports. 10, 1, 10 p., 16566.Research output: Contribution to journal › Article › peer-review