Research Output per year
Personal profile
Research Interests
Kinetic processes in thin films, metal-Si interfaces, electromigration, Pb-free solder metallurgy, low dielectric constant thin film,phase change driven by high current density and high electric and magnetic fields.
Education/Academic qualification
PhD, Harvard University
External positions
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Research Output
Deformation induced columnar grain rotation in nanotwinned metals
Li, Y. J., Hsu, C. W., Ting, Y. H., Tsou, N-T., Lo, Y-C., Wu, W. W., Tu, K-N. & Chen, C., 21 Oct 2020, In : Materials Science and Engineering A. 797, 140045.Research output: Contribution to journal › Article
Effect of adding Ag to the medium entropy SnBiIn alloy on intermetallic compound formation
Pu, L., Liu, Y., Yang, Y., He, Q., Zhou, Z., Zhao, X., Tan, C. & Tu, K. N., 1 Aug 2020, In : Materials Letters. 272, 127891.Research output: Contribution to journal › Article
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints
Gusak, A. M., Tu, K-N. & Chen, C., 1 Apr 2020, In : Scripta Materialia. 179, p. 45-48 4 p.Research output: Contribution to journal › Article
Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films
Tseng, C. H., Tseng, I. H., Huang, Y. P., Hsu, Y. T., Leu, J-P., Tu, K-N. & Chen, C., Oct 2020, In : Materials Characterization. 168, 110545.Research output: Contribution to journal › Article
Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration
Tu, K-N. & Gusak, A. N., Sep 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 9, p. 1427-1431 5 p.Research output: Contribution to journal › Article