Projects per year
Personal profile
Research Interests
Semiconductor production and integration
Low dielectric materials
Nanometer and thin film material
Research of novel low dielectric materials
OLED and soft crystal package applications
New underfill materials in the packaging process
Die / Packaging Interaction and Thermo-mechanical Behavior in Cu / Low-k Interconnects
Thermoelectric materials
Education/Academic qualification
PhD, University of Minnesota Twin Cities
External positions
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Projects
Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/20 → 31/12/20
Project: Government Ministry › Ministry of Science and Technology
Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/19 → 31/12/19
Project: Government Ministry › Ministry of Science and Technology
PEALD Silicon Carbonitride Thin Films for Microelectronics Applications
1/08/18 → 30/06/20
Project: Government Ministry › Ministry of Science and Technology
Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/18 → 31/12/18
Project: Government Ministry › Ministry of Science and Technology
Back-end-of-the-line Silicon Carbonitride Dielectrics for Resistive Switching
1/08/17 → 31/03/19
Project: Government Ministry › Ministry of Science and Technology
Research Output
A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups
Rasadujjaman, M., Wang, Y., Zhang, L., Naumov, S., Attallah, A. G., Liedke, M. O., Koehler, N., Redzheb, M., Vishnevskiy, A. S., Seregin, D. S., Wu, Y., Zhang, J., Leu, J., Wagner, A., Vorotilov, K. A., Schulz, S. E. & Baklanov, M. R., 15 Oct 2020, In : Microporous and Mesoporous Materials. 306, 110434.Research output: Contribution to journal › Article
A study of the relationship between endurance and retention reliability for a HfOx-based resistive switching memory
Chung, W. M., Chang, Y. F., Hsu, Y. L., Chen, Y. C. D., Lin, C. C., Lin, C. H. & Leu, J-P., Sep 2020, (Accepted/In press) In : IEEE Transactions on Device and Materials Reliability.Research output: Contribution to journal › Article
Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films
Tseng, C. H., Tseng, I. H., Huang, Y. P., Hsu, Y. T., Leu, J-P., Tu, K-N. & Chen, C., Oct 2020, In : Materials Characterization. 168, 110545.Research output: Contribution to journal › Article
Properties of organosilicate low-k films with 1,3- A nd 1,3,5-benzene bridges between Si atoms
Liu, C., Lv, C., Kohler, N., Wang, X., Lin, H., He, Z., Wu, Y. H., Leu, J., Wei, S., Zhang, J., Yan, J., Palov, A. P. & Baklanov, M. R., 1 Jul 2020, In : Japanese Journal of Applied Physics. 59, SL, SLLG01.Research output: Contribution to journal › Article
Open Access
Effect of the C-bridge on UV properties of organosilicate films
Seregin, D. S., Naumov, S., Chang, W. Y., Wu, Y. H., Wang, Y., Kotova, N. M., Vishnevskiy, A. S., Wei, S., Zhang, J., Vorotilov, K. A., Redzheb, M., Leu, J-P. & Baklanov, M. R., 1 Sep 2019, In : Thin Solid Films. 685, p. 329-334 6 p.Research output: Contribution to journal › Article