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Personal profile

Research Interests

Semiconductor production and integration
Low dielectric materials
Nanometer and thin film material
Research of novel low dielectric materials
OLED and soft crystal package applications
New underfill materials in the packaging process
Die / Packaging Interaction and Thermo-mechanical Behavior in Cu / Low-k Interconnects
Thermoelectric materials

Education/Academic qualification

PhD, University of Minnesota Twin Cities

External positions

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Recent external collaboration on country level. Dive into details by clicking on the dots.
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