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Personal profile

Research Interests

Semiconductor production and integration
Low dielectric materials
Nanometer and thin film material
Research of novel low dielectric materials
OLED and soft crystal package applications
New underfill materials in the packaging process
Die / Packaging Interaction and Thermo-mechanical Behavior in Cu / Low-k Interconnects
Thermoelectric materials

Education/Academic qualification

PhD, University of Minnesota Twin Cities

External positions

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Projects

Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices

Leu, J.

1/01/2031/12/20

Project: Government MinistryMinistry of Science and Technology

Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices

Leu, J.

1/01/1931/12/19

Project: Government MinistryMinistry of Science and Technology

PEALD Silicon Carbonitride Thin Films for Microelectronics Applications

Leu, J.

1/08/1830/06/20

Project: Government MinistryMinistry of Science and Technology

Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices

Leu, J.

1/01/1831/12/18

Project: Government MinistryMinistry of Science and Technology

Back-end-of-the-line Silicon Carbonitride Dielectrics for Resistive Switching

Leu, J.

1/08/1731/03/19

Project: Government MinistryMinistry of Science and Technology

Research Output

A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups

Rasadujjaman, M., Wang, Y., Zhang, L., Naumov, S., Attallah, A. G., Liedke, M. O., Koehler, N., Redzheb, M., Vishnevskiy, A. S., Seregin, D. S., Wu, Y., Zhang, J., Leu, J., Wagner, A., Vorotilov, K. A., Schulz, S. E. & Baklanov, M. R., 15 Oct 2020, In : Microporous and Mesoporous Materials. 306, 110434.

Research output: Contribution to journalArticle

  • A study of the relationship between endurance and retention reliability for a HfOx-based resistive switching memory

    Chung, W. M., Chang, Y. F., Hsu, Y. L., Chen, Y. C. D., Lin, C. C., Lin, C. H. & Leu, J-P., Sep 2020, (Accepted/In press) In : IEEE Transactions on Device and Materials Reliability.

    Research output: Contribution to journalArticle

  • Kinetic study of grain growth in highly (111)-preferred nanotwinned copper films

    Tseng, C. H., Tseng, I. H., Huang, Y. P., Hsu, Y. T., Leu, J-P., Tu, K-N. & Chen, C., Oct 2020, In : Materials Characterization. 168, 110545.

    Research output: Contribution to journalArticle

  • Properties of organosilicate low-k films with 1,3- A nd 1,3,5-benzene bridges between Si atoms

    Liu, C., Lv, C., Kohler, N., Wang, X., Lin, H., He, Z., Wu, Y. H., Leu, J., Wei, S., Zhang, J., Yan, J., Palov, A. P. & Baklanov, M. R., 1 Jul 2020, In : Japanese Journal of Applied Physics. 59, SL, SLLG01.

    Research output: Contribution to journalArticle

    Open Access
  • Effect of the C-bridge on UV properties of organosilicate films

    Seregin, D. S., Naumov, S., Chang, W. Y., Wu, Y. H., Wang, Y., Kotova, N. M., Vishnevskiy, A. S., Wei, S., Zhang, J., Vorotilov, K. A., Redzheb, M., Leu, J-P. & Baklanov, M. R., 1 Sep 2019, In : Thin Solid Films. 685, p. 329-334 6 p.

    Research output: Contribution to journalArticle