Projects per year
Personal profile
Research Interests
Semiconductor production and integration
Low dielectric materials
Nanometer and thin film material
Research of novel low dielectric materials
OLED and soft crystal package applications
New underfill materials in the packaging process
Die / Packaging Interaction and Thermo-mechanical Behavior in Cu / Low-k Interconnects
Thermoelectric materials
Education/Academic qualification
PhD, University of Minnesota Twin Cities
External positions
Fingerprint
Dive into the research topics where Jih-Perng Leu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
Network
Recent external collaboration on country level. Dive into details by clicking on the dots.
Projects
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Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/20 → 31/01/21
Project: Government Ministry › Ministry of Science and Technology
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Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/19 → 31/01/20
Project: Government Ministry › Ministry of Science and Technology
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PEALD Silicon Carbonitride Thin Films for Microelectronics Applications
1/08/18 → 30/06/20
Project: Government Ministry › Ministry of Science and Technology
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Ultra-low-k Dielectrics for Next Generation of Semiconductor Devices
1/01/18 → 31/01/19
Project: Government Ministry › Ministry of Science and Technology
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Back-end-of-the-line Silicon Carbonitride Dielectrics for Resistive Switching
1/08/17 → 31/03/19
Project: Government Ministry › Ministry of Science and Technology
Research Output
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A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups
Rasadujjaman, M., Wang, Y., Zhang, L., Naumov, S., Attallah, A. G., Liedke, M. O., Koehler, N., Redzheb, M., Vishnevskiy, A. S., Seregin, D. S., Wu, Y., Zhang, J., Leu, J., Wagner, A., Vorotilov, K. A., Schulz, S. E. & Baklanov, M. R., 15 Oct 2020, In: Microporous and Mesoporous Materials. 306, 110434.Research output: Contribution to journal › Article › peer-review
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A study of the relationship between endurance and retention reliability for a HfOx-based resistive switching memory
Chung, W. M., Chang, Y. F., Hsu, Y. L., Chen, Y. C. D., Lin, C. C., Lin, C. H. & Leu, J-P., Sep 2020, (Accepted/In press) In: IEEE Transactions on Device and Materials Reliability.Research output: Contribution to journal › Article › peer-review
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Corrigendum to “A detailed ellipsometric porosimetry and positron annihilation spectroscopy study of porous organosilicate-glass films with various ratios of methyl terminal and ethylene bridging groups” [Microporous Mesoporous Mater. 306 (2020) 110434] (Microporous and Mesoporous Materials (2020) 306, (S1387181120304376), (10.1016/j.micromeso.2020.110434))
Rasadujjaman, M., Wang, Y., Zhang, L., Naumov, S., Attallah, A. G., Liedke, M. O., Koehler, N., Redzheb, M., Vishnevskiy, A. S., Seregin, D. S., Wu, Y., Zhang, J., Leu, J., Wagner, A., Vorotilov, K. A., Schulz, S. E. & Baklanov, M. R., 2020, (Accepted/In press) In: Microporous and Mesoporous Materials. 110785.Research output: Contribution to journal › Comment/debate
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Effects of methyl terminal and carbon bridging groups ratio on critical properties of porous organosilicate-glass films
Vishnevskiy, A. S., Naumov, S., Seregin, D. S., Wu, Y. H., Chuang, W. T., Rasadujjaman, M., Zhang, J., Leu, J., Vorotilov, K. A. & Baklanov, M. R., 2 Oct 2020, In: Materials. 13, 20, p. 1-21 21 p., 4484.Research output: Contribution to journal › Article › peer-review
Open Access -
Effects of stoichiometry on structural, morphological and nanomechanical properties of bi2 se3 thin films deposited on inp(111) substrates by pulsed laser deposition
Hwang, Y. M., Pan, C. T., Chen, B. S., Le, P. H., Uyen, N. N., Tuyen, L. T. C., Nguyen, V., Luo, C-W., Juang, J-Y., Leu, J-P. & Jian, S. R., Oct 2020, In: Coatings. 10, 10, p. 1-12 12 p., 958.Research output: Contribution to journal › Article › peer-review
Open Access