Projects per year
Personal profile
Research Interests
VLSI Circuit Design and Test, Communication Circuit System
Experience
2000/8~2002/7 Professor, Department of Electrical Engineering, National Central University
2004/1~2007/5 CEO, National Science and Technology Program for System-on-Chip
2006/8~2010/7 Professor, Department of Electrical and Control Engineering, National Chiao Tung University
2008/8~2012/7 Consultant, Ministry of Education
2009/8~2011/7 Professor and Chair, Department of Electrical Engineering, National Chiao Tung University
2011/1~2013/12 Chairman, Spring Foundation of NCTU
2012/1~2014/12 Advisory committee, Yuan Ze University
2012/1~2014/12 Affairs, Ministry of Economic
Education/Academic qualification
PhD, University of Wisconsin-Madison
External positions
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Network
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Projects
Micro-Watt Sensing IC Design for the Deformation Detection of Elastic Conductive Fabric
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
Micro-Watt Sensing IC Design for the Deformation Detection of Elastic Conductive Fabric
1/08/19 → 31/07/20
Project: Government Ministry › Ministry of Science and Technology
Single Chip Bio-Spectroscopic Mete
1/08/18 → 31/07/19
Project: Government Ministry › Ministry of Science and Technology
Talent Cultivation Program for Smart Living Industry (II)
1/04/18 → 31/03/19
Project: Government Ministry › Ministry of Education(Include School)
Single Chip Bio-Spectroscopic Mete
1/08/17 → 31/07/18
Project: Government Ministry › Ministry of Science and Technology
Research Output
Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation
Lin, T., Su, C-C., Hung, C-C., Nidhi, K., Tu, C. & Huang, S. C., 14 May 2019, Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019. Institute of Electrical and Electronics Engineers Inc., p. 1661-1666 6 p. 8714895. (Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
High-R Poly Resistance Deviation Improvement from Suppressions of Back-End Mechanical Stresses
Lin, T., Ho, Y. & Su, C-C., 1 Oct 2017, In : IEEE Transactions on Electron Devices. 64, 10, p. 4233-4241 9 p., 8026567.Research output: Contribution to journal › Article
Open Access
LDMOS channel thermometer based on a thermal resistance sensor for balancing temperature in monolithic power ICs
Lin, T., Ho, Y. & Su, C-C., 15 Jun 2017, In : Sensors (Switzerland). 17, 6, 1397.Research output: Contribution to journal › Article
Open Access
A 0.5V/22 fi W low power transceiver ic for use in intra-body communication system
Tseng, Y., Lin, T., Yau, S., Ho, Y. & Su, C-C., 27 Dec 2016, ISOCC 2016 - International SoC Design Conference: Smart SoC for Intelligent Things. Institute of Electrical and Electronics Engineers Inc., p. 71-72 2 p. 7799738. (ISOCC 2016 - International SoC Design Conference: Smart SoC for Intelligent Things).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Evaluation and verification of channel transmission characteristics of human body for optimizing data transmission rate in electrostatic-coupling intra body communication system: A comparative analysis
Tseng, Y., Su, C-C. & Ho, Y., 1 Feb 2016, In : PLoS ONE. 11, 2, e0148964.Research output: Contribution to journal › Article
Open Access
Prizes
Excellent Chip Awards, Best Design, National Chip Implementation Center
Su, Chau-Chin (Recipient), 2003
Prize: Honorary award
Excellent Chip Awards, Best Design, National Chip Implementation Center
Su, Chau-Chin (Recipient), 2004
Prize: Honorary award
Excellent Chip Awards, Best Design, National Chip Implementation Center
Su, Chau-Chin (Recipient), 2006
Prize: Honorary award
Excellent Chip Awards, Best Design, National Chip Implementation Center
Su, Chau-Chin (Recipient), 2011
Prize: Honorary award
Excellent Chip Awards, Best Design, National Chip Implementation Center
Su, Chau-Chin (Recipient), 2005
Prize: Honorary award