Projects per year
Organization profile
organization profile
The department develops technologies related to electronics by using intellect and resource with the purpose of solving the problems of human life and improving the quality of living environment. It holds the idea to coordinate with the development of national technology and economy, follow the world trend and cultivate excellent leading talents in electronic engineering. It takes the scientific attitude of absorbing the new to look far ahead as its foundation and emphasizes the engineering spirit of working pragmatically.
1. Cultivate students’professional knowledge to master basic and speciality of electronic engineering and combine with practical operation thus realize the purpose of integrating theories and practice. Train students the ability of inference, analysis, innovation and integration.
2. Practice diverse learning, educate students with profound knowledge, communication skill and team spirit for meeting challenges in different phases of life. Make them understand professional ethics and social responsibility.
3. Broaden international perspective and create international learning environment to make student know about the trend of domestic and foreign society and industry. Cultivate them to be electronic elites and leading talents in the world.
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Network
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Profiles
Projects
Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
時頻分析技術應用於低截獲率雷達信號的偵測與辨識
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
Wide-Bandwidth Analog-Digital Interface
1/08/20 → 31/07/21
Project: Government Ministry › Ministry of Science and Technology
Research Output
A Delay-Correlating Direct-Sequence Spread-Spectrum (DS/SS) Radar System-on-Chip Operating at 183-205 GHz in 28 nm CMOS
Tang, A., Carey, R., Virbila, G., Zhang, Y., Huang, R. & Frank Chang, M. C., Mar 2020, In : IEEE Transactions on Terahertz Science and Technology. 10, 2, p. 212-220 9 p., 8968616.Research output: Contribution to journal › Article
A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, M. Y., Chen, H-M., Chen, K. N., Wu, S. H., Lee, Y. M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding
Lu, C. H., Yang, Y. L., Chen, C. P., Tsai, B. L. & Chen, K. N., Jan 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 168-175 8 p., 8843892.Research output: Contribution to journal › Article
Prizes
Activities
- 1 Invited talk
IEEE Interconnect Technology Conference (IITC)
Kuan-Neng Chen (Speaker)
4 Jun 2018
Activity: Talk or presentation › Invited talk