Organization profile

organization profile

The department develops technologies related to electronics by using intellect and resource with the purpose of solving the problems of human life and improving the quality of living environment. It holds the idea to coordinate with the development of national technology and economy, follow the world trend and cultivate excellent leading talents in electronic engineering. It takes the scientific attitude of absorbing the new to look far ahead as its foundation and emphasizes the engineering spirit of working pragmatically.
1. Cultivate students’professional knowledge to master basic and speciality of electronic engineering and combine with practical operation thus realize the purpose of integrating theories and practice. Train students the ability of inference, analysis, innovation and integration.
2. Practice diverse learning, educate students with profound knowledge, communication skill and team spirit for meeting challenges in different phases of life. Make them understand professional ethics and social responsibility.
3. Broaden international perspective and create international learning environment to make student know about the trend of domestic and foreign society and industry. Cultivate them to be electronic elites and leading talents in the world.

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    Projects

    Low-Temperature Short-Duration Cu Hybrid Bonding Technology for 3D IC and Heterogeneous Integration

    Chen, K.

    1/08/2031/07/21

    Project: Government MinistryMinistry of Science and Technology

    時頻分析技術應用於低截獲率雷達信號的偵測與辨識

    Liu, C.

    1/08/2031/07/21

    Project: Government MinistryMinistry of Science and Technology

    Wide-Bandwidth Analog-Digital Interface

    Wu, J.

    1/08/2031/07/21

    Project: Government MinistryMinistry of Science and Technology

    Research Output

    A Delay-Correlating Direct-Sequence Spread-Spectrum (DS/SS) Radar System-on-Chip Operating at 183-205 GHz in 28 nm CMOS

    Tang, A., Carey, R., Virbila, G., Zhang, Y., Huang, R. & Frank Chang, M. C., Mar 2020, In : IEEE Transactions on Terahertz Science and Technology. 10, 2, p. 212-220 9 p., 8968616.

    Research output: Contribution to journalArticle

  • A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design

    Huang, M. Y., Chen, H-M., Chen, K. N., Wu, S. H., Lee, Y. M. & Su, A. Y., Jun 2020, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 2236-2241 6 p. 9159244. (Proceedings - Electronic Components and Technology Conference; vol. 2020-June).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Adhesion properties of electroplating process between polyimide and metal layer for polymer/metal hybrid bonding

    Lu, C. H., Yang, Y. L., Chen, C. P., Tsai, B. L. & Chen, K. N., Jan 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 1, p. 168-175 8 p., 8843892.

    Research output: Contribution to journalArticle

  • Prizes

    Academic Award, Ministry of Education

    Chien-Ping Lee (Recipient), 2001

    Prize: Honorary award

    Academician, Academia Sinica

    Chang, Mau-Chung (Recipient), 2012

    Prize: Honorary award

    Advantech Young Professor Award, Advantech

    Chen, Kuan-Neng (Recipient), 2010

    Prize: Honorary award

    Activities

    • 1 Invited talk

    IEEE Interconnect Technology Conference (IITC)

    Kuan-Neng Chen (Speaker)

    4 Jun 2018

    Activity: Talk or presentationInvited talk