Sputtering System B

Equipment/facility: Equipment

  • Location

    固態電子系統大樓 3 樓實驗室

    Taiwan

Equipments Details

Description

功能:薄膜濺鍍
重要規格: (1) 人機界面. (2) 3支6吋濺鍍陰極. (3) 可放6片WAFER(6吋or4吋皆可,可自行分配,共6片). (4) POWER: DC:2500W*2台與RF:1000W*1台. (5) 氣體:MFC for Ar、N2與O2. (6) 抽氣系統:RP + Cryo Pump. (7) 可鍍多層膜. (8) 基板載台轉速0~30rpm,可調控. (9) 可升溫至300℃
Photo associated with equipment

Details

NameKao Duen Technology Corporation
ManufacturersKao Duen Technology Corporation

Fingerprint

Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.