Sputtering System

Equipment/facility: Equipment

  • Location

    固態電子系統大樓 3 樓實驗室

    Taiwan

Equipments Details

Description

功能:薄膜濺鍍
重要規格: (1) 3支4吋濺鍍陰極. (2) POWER: DC 1500W*2台與RF:600W*1台. (3) 可放4吋晶片6片 或 6吋晶片3片. (4) 氣體:MFC for Ar, O2,N2. (5) 抽氣系統:RP + Cryo Pump. (6) 可鍍多層膜
Photo associated with equipment

Details

NameIon Tech Microvac 450CB
Acquisition date1/04/91
ManufacturersIon Tech

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