Si Deep-RIE

    Kuan-Neng Chen (Manager), 進章 胡 (Operator) & 正維 李 (Operator)

Equipment/facility: Equipment

  • Location

    固態電子系統大樓 1樓116實驗室

    Taiwan

Equipments Details

Description

功能: (1) 乾式蝕刻,以矽深蝕刻為主(Bosch Process)
重要規格: (1) 使用氣體包含C4F8、SF6、CHF3、CF4、Ar、O2,以He gas系統冷卻,4" wafer為主。
Photo associated with equipment

Details

Name Oxford Estrelas 100
Acquisition date1/12/16
ManufacturersOxford Instruments Group Plc

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