KD-Sputter-Load luck

Equipment/facility: Equipment

  • Location

    奈米中心3樓無塵室

    Taiwan

Equipments Details

Description

重要規格: (1) 人機界面. (2) 2支6吋濺鍍陰極. (3) 每次可放1片WAFER (6吋or4吋皆可,4吋須貼在載片上). (4) POWER: DC:1500W*1台與RF:1000W*1台. (5) 氣體:MFC for Ar與O2. (6) 抽氣系統:RP + Turbo Pump. (7) 基板載台轉速5rpm,可調控. (8) 可升溫最高300oC. (9) 靶材種類:ZnO與IGZO

服務項目: (1) 開放ZnO、IGZO薄膜濺鍍。
*標準製程參數
瓦數:100W
Ar=50sccm
O2=0~1sccm
製程壓力:5mtorr
製程溫度:室溫
Photo associated with equipment

Details

NameSputter - Load Luck
Acquisition date1/11/11
ManufacturersKao Duen Technology Corporation

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