HDP-RIE

    Kuan-Neng Chen (Manager), 進章 胡 (Operator) & 正維 李 (Operator)
Department of Electronics Engineering

Equipment/facility: Equipment

  • Location

    固態電子系統大樓 1樓116實驗室

    Taiwan

Equipments Details

Description

功能： (1) 乾式蝕刻，以蝕刻Al材料為主
重要規格： (1) 使用氣體包含BCl3、Cl2、CF4、CHF3、Ar、O2、SF6，ICP RF最大功率900W，Bias RF最大功率300W，以He gas系統冷卻，4" wafer為主。
Photo associated with equipment

Details

NameHDP-RIE
Acquisition date10/03/99
Manufacturers慶康科技

Contact Information

NameKuan-Neng Chen
Phone胡進章 先生 (TEL：03-5712121-55607, 55666)
Mobile李正維 先生 (TEL：03-5712121-55660, 55666)
Emailsjackhu@faculty.nctu.edu.tw cwlee@nctu.edu.tw
Web addressesWebsite, Booking/Management

Terms of loan/booking

Available for loan - internal and external

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