HDP-RIE

    Kuan-Neng Chen (Manager), 進章 胡 (Operator) & 正維 李 (Operator)

Equipment/facility: Equipment

  • Location

    固態電子系統大樓 1樓116實驗室

    Taiwan

Equipments Details

Description

功能: (1) 乾式蝕刻,以蝕刻Al材料為主
重要規格: (1) 使用氣體包含BCl3、Cl2、CF4、CHF3、Ar、O2、SF6,ICP RF最大功率900W,Bias RF最大功率300W,以He gas系統冷卻,4" wafer為主。

Details

NameHDP-RIE
Acquisition date10/03/99
Manufacturers慶康科技

Fingerprint Explore the research areas in which this equipment has been used. These labels are generated based on the related outputs. Together they form a unique fingerprint.