Equipments Details
Description
功能: (1) 可用於多層薄膜蒸鍍(限半導體製程常用之材料)
重要規格: (1) EB gun Model EGK-3M*2.5kw EB power 2台. (2) 抽氣系統:RP + Cryo pump U-10 pu(2300 L/S N2),最低壓力2*10¯6Torr. (3) 基板大小:4吋晶片18片或 6吋晶片3片+ 4吋6片
重要規格: (1) EB gun Model EGK-3M*2.5kw EB power 2台. (2) 抽氣系統:RP + Cryo pump U-10 pu(2300 L/S N2),最低壓力2*10¯6Torr. (3) 基板大小:4吋晶片18片或 6吋晶片3片+ 4吋6片

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Details
Name | ULVAC EBX-10C |
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Acquisition date | 1/05/93 |
Manufacturers | ULVAC, Inc. |
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